Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂
基体,间苯二胺和二氨基二苯甲烷的低融点混合物
剂,铜粉导
填料,制备了
各向同性导胶。
剂,硬者Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点混合物剂,铜粉导填料,制备了各向同性导胶。
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