phenylenediamine

Novel controlled releasing polythiourea microcapsules were prepared from terephthaloyl diisothiocyanate and o-phenylenediamine by interfacial polycondensation.

以对苯甲酰异氰酸酯和邻苯胺原料通过界面缩法合成脲缓释微胶囊。

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂基体,间苯胺和氨基苯甲烷的低融点混合物剂,铜粉导电填料,制备热各向同性导电胶。