Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最用正交试验的方法对肖特基
件
部封装中的压焊工艺进行
参数优化设计。
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最用正交试验的方法对肖特基
件
部封装中的压焊工艺进行
参数优化设计。
The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.
本文对一些肖特基势混频二极管本征噪声温度进行
测试和分析。介绍
在常温和致冷下混频二极管本征噪声的测试方法。
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