A numerical model of polymer debinding in PIM is proposed, the stress distribution in the greenware is analyzed and the process parameters is discussed.
建立
PIM
过程中高分子高温裂解除的数学模型,分析生坯中
力分布,并讨论热工艺参数。
A numerical model of polymer debinding in PIM is proposed, the stress distribution in the greenware is analyzed and the process parameters is discussed.
建立PIM过程中高分子高温裂解除的数学模型,分析生坯中力分布,并讨论热工艺参数。
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