A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.
在迴焊过,
BGA锡球内
隙有气
而形成吹
.
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69. Question: How does the temperature gradient during reflow soldering affect the solder joints in PCBA? Answer: A non - uniform temperature gradient can cause stress in the solder joints, leading to cracks or other defects.
69. 问:焊过程中的温度梯度如何影响 PCBA 中的焊点?答案: 不均匀的温度梯度会在焊点中产生应力,从而导致裂纹或其他缺陷。
46. Question: In PCBA, why is it important to control the reflow soldering profile accurately? Answer: An inaccurate profile can lead to issues like insufficient solder joint formation, component damage due to overheating, or uneven soldering.
46. 问题:在 PCBA 中,为什么准确控制焊曲线很重要?答案:不准确的配置文件会导致焊点形
不足、过热导致组件损坏或焊接不均匀等问题。