Where the mask blocks the light, the photoresist is unchanged.

在掩模阻挡线地方，没有变化。

The wafer is then sent through a hard bake to harden the remaining photoresist.

然后将晶圆送去进行硬烘烤，以使剩余变硬。

Then, a liquid called " photoresist" is spun on and baked to harden.

接着，一种名为“”体被均匀涂抹并烘烤硬化。

Wherever the light from  the stencil touches the wafer, the photoresist is weakened.

当模板上线接触到晶圆时，就会被削弱。

In the lit areas, a reaction weakens the photoresist's chemical bonds.

在区域，反应会削弱化学键。

To clean up, we use yet another special chemical that washes away any remaining photoresist.

为了清理，我们使用了另一种特殊化学物质来洗掉所有残留。

Note that the oxide layer under the photoresist is protected.

请注意，下方氧化层受到保护。

And new problems arise: today, PFAS-based photoresists are essential to make ever-smaller features.

新问题出现了：如今，基于PFAS对于制造越来越小特征至关重要。

Once again, we wash away remaining photoresist.

我们再次洗掉剩余。

Photoresists aren’t very useful by themselves, but are super powerful when used in conjunction with a photomask.

本身不是很有用，但与掩模结合使用时非常强大。

The wafer is doused in another chemical to wash away that weakened photoresist, leaving an image of the mask.

晶圆会被另一种化学物质冲洗， 以清除那层被削弱阻剂，留下掩模图像。

Once more, we apply a photoresist, and use a new photomask to etch little channels.

再一次，我们应用，并使用新掩模来蚀小通道。

Next the  wafer is sent to a photoresist stripper where the mask layer is removed.

接下来，晶圆被送往剥离器，去除掩模层。

The process essentially starts again, first by building up a fresh oxide layer ...which we coat in photoresist.

这个过程基本上又开始了，首先是建立一个新氧化层… … 我们在上面涂上。

Next, using UV Light and a stencil, a pattern is applied to the photoresist.

接下来，使用紫外线和模板将图案应用到上。

These tools include the  photoresist spin coater, photolithography tool, developer and photoresist stripper.

这些工具包括旋涂机、工具、显影剂和剥离剂。

The wafer then goes to the developer  and the weakened photoresist is washed away, leaving only the patterned nanoscopic stencil on  the wafer.

然后， 晶圆进入显影剂， 弱化被洗掉，只在晶圆上留下图案化纳米级模板。

Next photoresist is  spread across the surface and the wafer is sent through a soft bake to remove the solvent.

接下来，将涂抹在表面，并将晶圆送去软烘烤以去除溶剂。

So, very similar to before, we apply a photoresist, use a photomask, dissolve the exposed resist, and use a chemical to remove any exposed metal.

因此，与之前非常相似， 我们应用， 使用掩模， 溶解暴露抗蚀剂，并使用化学物质去除任何暴露金属。

To start, a layer of insulating silicon dioxide is deposited  on top of the wafer and then a layer of light sensitive photoresist is spread across the top.

首先，在晶圆顶部沉积一层绝缘二氧化硅，然后在顶部涂上一层感。