bonds

This glue makes a good firm bond.

这种胶水实。

The bonds are redeemable by annual drawings.

公债每年抽签偿还。

This new glue makes a firmer bond.

新胶水牢。

Compared with diolefine rubber,EPDM has less double bond.

与二烯烃橡胶相比,EPDM的双键少。

Or they can buy unsell (and sell) existing bonds.

他们也可以买卖现有的债券。

The peptide bond is the same as the imido bond of biuret.

处于等电点状态的蛋白质加热时凝固最完全、最迅速。

This glue is our new product and makes a firmer bond.

"这种胶水是我们的新产品,力强。"

This adhesive must be applied to both surfaces which are to be bonded together.

要接的两个面都须涂上这种黏合剂。

The relationship between bond valence and bond covalency has been investigated by a semiempirical method.

用一种半经验方法研究固体材料中键电荷与键共价性的关系。

You need a strong adhesive to bond wood to metal.

需要强力胶才能把木料在金属上。

The whisky was taken to bonded warehouses at Port Dundee.

威士忌酒已送到邓迪港的保稅仓库。

All perpends are to be strictly true and square and the whole properly bonded together.

所有直角处须精确和方正，且整体要合妥当。

We entered into a solemn bond.

我们一份正式合约。

Fabrics are produced by bonding yarns together in terms of weaving or knitting, lacemaking, braiding or felting.

在网状构以及处理组合、烘乾、热定形等装订设备的辅助下，非编织布料也可被使用。

The composition of butadiene polyperoxide is analyzed.The energy of explosion reactions is calculated by bond energy method.

分析丁二烯聚过氧化物的组成,用键能法计算爆炸反应能量,果与实例相符。

Grinding paper with self bonding nappa base (for fixinf on cloth ) with grain P40 up to P100.

研磨的编织abrasive (sand) complect:1. 以寛115毫米的氯丁(二烯)橡胶为底的织物贴在工具上.Cloth 2.P40Z至P100的砂纸贴再皮革上.

The great viscosimetry onusseit, its solid water with high, in the small, cohesion, bond strength can vary widely.

度大的胶剂，其固体含里高，水分少，内聚力大，强度也大。

The resultant ionized bond can be cleaved by a hemi-heterolysis process, affording a cation and a neutral radical.

生成的离子化键能由半异裂的过程而开裂，提供一个正离子和一个中性的游离基。

In addition,The general macrograph characters of spalling of bonding layer and shallow working lining,and their causes were described.

总轧辊磨损预报模型的研究现状,并详细介绍典型的磨损预报模型,最后展望冷轧辊研究工作的方向。

The same forces and mechanisms responsible for size enlargement in roller compaction are responsible for bond formation during tabletting.

碾压中施加于颗粒增大的力和机理也用于压片的合成型。